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2SJ293 Silicon P-Channel MOS FET November 1996 Application High speed power switching Features * * * * * * Low on-resistance High speed switching Low drive current 4 V gate drive device can be driven from 5 V source Suitable for switching regulator, DC-DC converter Avalanche ratings Outline TO-220FM D G 1 23 1. Gate 2. Drain 3. Source S 2SJ293 Absolute Maximum Ratings (Ta = 25C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Notes 1. PW 10 s, duty cycle 1% 2. Value at TC = 25C 3. Value at Tch = 25C, Rg 50 1/2 Symbol VDSS VGSS ID ID(pulse)* IDR IAP* 3 1 Ratings -60 20 -15 -60 -15 -15 Unit V V A A A A mJ W C C EAR* Tch 3 19 2 Pch* 30 150 -55 to +150 Tstg 2 2SJ293 Electrical Characteristics (Ta = 25C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Symbol Min V(BR)DSS V(BR)GSS IGSS VGS(off) RDS(on) |yfs| Ciss Coss Crss td(on) tr td(off) tf VDF trr -60 20 -- -- -1.0 -- -- 8 -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- 0.075 0.09 12 1450 670 240 20 95 230 160 -1.5 160 Max -- -- 10 -250 -2.25 0.095 0.12 -- -- -- -- -- -- -- -- -- -- Unit V V A A V S pF pF pF ns ns ns ns V ns IF = -15 A, VGS = 0 IF = -15 A, VGS = 0, diF/dt = 50 A/s ID = -8 A, VGS = -10 V, RL = 3.75 Test conditions ID = -10 mA, VGS = 0 IG = 100 A, VDS = 0 VGS = 16 V, VDS = 0 VDS = -50 V, VGS = 0 ID = -1 mA, VDS = -10 V ID = -8 A, VGS = -10 V* ID = -8 A, VGS = -4 V* VDS = -10 V, VGS = 0, f = 1 MHz 1 1 Zero gate voltage drain current IDSS Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Note 1. Pulse test ID = -8 A, VDS = -10 V* 1 See characteristic curves of 2SJ290 3 2SJ293 Power vs. Temperature Derating 45 Channel Dissipation Pch (W) 30 15 0 50 100 150 Case Temperature Tc (C) Maximum Safe Operation Area 10s -100 -30 10 0 is s DS is (o ar n) ea PW 1 m I D (A) s = O lim pe ite rati d on by in R th -10 -3 -1 10 DC O pe ra m s (1 sh tio ot ) Drain Current n (T c = 25 Ta = 25C C ) -0.3 -0.1 -3 -10 -0.1 -0.3 -1 -30 -100 Drain to Source Voltage V DS (V) Noremalized Transient Thermal Impedance vs. Pulse Width Normalized Transient Thermal Impedance s (t) 3 D=1 1.0 0.5 0.3 0.2 0.1 0.1 0.05 0.02 0.03 0.01 0.01 10 1 shot Pulse 100 1m 10 m Pulse Width PW (S) 100 m 1 10 ch - c(t) = s(t) . ch - c ch - c = 4.17C / W, Tc = 25C PW D= T P DM T PW Tc = 25C 4 2SJ293 When using this document, keep the following in mind: 1. This document may, wholly or partially, be subject to change without notice. 2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without Hitachi's permission. 3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any other reasons during operation of the user's unit according to this document. 4. Circuitry and other examples described herein are meant merely to indicate the characteristics and performance of Hitachi's semiconductor products. Hitachi assumes no responsibility for any intellectual property claims or other problems that may result from applications based on the examples described herein. 5. No license is granted by implication or otherwise under any patents or other rights of any third party or Hitachi, Ltd. 6. MEDICAL APPLICATIONS: Hitachi's products are not authorized for use in MEDICAL APPLICATIONS without the written consent of the appropriate officer of Hitachi's sales company. Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi's products are requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL APPLICATIONS. 5 |
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